Authors: R. J. C. Carbas, A. C. M. Reis, L. F. M. da Silva

This study aims to understand the effect of curing temperature on the glass transition temperature, Tg, of epoxy adhesives. The curing process used was divided into two stages. The initial stage was performed at different temperatures and post-cure at room temperature until the adhesive reached full cure. Tg was determined as a function of the curing temperature of the adhesive. The behaviour of epoxy adhesives is similar. For cure temperatures below the glass transition temperature of the fully cured resin, Tg∞, with increasing cure temperature the Tg increases. For temperatures above Tg∞, with increasing cure temperature the Tg decreases.

R. J. C. Carbas¹ | A. C. M. Reis² | L. F. M. da Silva²
1 Instituto de Engenharia Mecânica ( IDMEC ), Universidade do Porto, Porto , Portugal
2 Departamento de Engenharia Mecânica (DEMec), Universidade do Porto, Portugal